Features

●Based on the high performance features of the SiRF Star III low power single chipset.

●Compact module size for easy integration: 15x14x2.8 mm (590.6x551.2x110.2 mil).

●SMT pads allow for fully automatic assembly processes equipment and reflow soldering

●RoHS compliant (lead-free)

●Cold/Warm/Hot Start Time: 42 / 38 / 1 sec.

●Reacquisition Time: 0.1 second

●RF Metal Shield for best performance in noisy environments

●Multi-path Mitigation Hardware

●TTL level serial port for GPS communications interface

●Protocol: NMEA-0183/SiRF Binary (default NMEA)

●Baud Rate: 9600, 19200 bps (default 9600)